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DATA SHEET
74LVC4245A Octal dual supply translating transceiver; 3-state
Product specification Supersedes data of 1998 Jul 29 File under Integrated Circuits, IC24 1999 Jun 15
Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
FEATURES * In accordance with JEDEC standard no. 8-1A * Wide supply voltage range: 3 V port: 1.5 to 3.6 V 5 V port: 1.5 to 5.5 V * CMOS low power consumption * Direct interface with TTL levels * Control inputs accept voltages up to 5.5 V. DESCRIPTION
74LVC4245A
The 74LVC4245A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. The 74LVC4245A is an octal dual supply translating transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. It is designed to interface between a 3 and 5 V bus in a mixed 3/5 V supply environment. The 74LVC4245A features an output enable (OE) input for easy cascading and a send/receive (DIR) input for direction control. (OE) controls the outputs so that the buses are effectively isolated. In suspend mode, when VCCA is zero, there will be no current flow from one supply to the other supply. The A-outputs must be set 3-state and the voltage on the A-bus must be smaller than Vdiode (typ. 0.7 V). VCCA VCCB (except in suspend mode).
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH An to Bn Bn to An CI/O CPDA input/output capacitance A port An to Bn Bn to An CPDB B port An to Bn Bn to An Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of the outputs. VI = GND to VCC; note 1 VI = GND to VCC; note 1 26 10.4 pF pF VI = GND to VCC; note 1 VI = GND to VCC; note 1 7.8 27.9 pF pF PARAMETER propagation delay CONDITIONS CL = 50 pF VCCA = 5.0 V VCCB = 3.3 V 4.0 4.0 10.0 ns ns pF TYPICAL UNIT
1999 Jun 15
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
FUNCTION TABLE See note 1. INPUT OE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGE OUTSIDE NORTH AMERICA 74LVC4245AD 74LVC4245ADB 74LVC4245APW PINNING PIN 1 2 3, 4, 5, 6, 7, 8, 9 and 10 11, 12 and 13 14, 15, 16, 17, 18, 19, 20 and 21 22 23 and 24 SYMBOL VCCA DIR A0 to A7 GND B7 to B0 OE VCCB direction control data inputs/outputs ground (0 V) data inputs/outputs NORTH AMERICA 74LVC4245AD 74LVC4245ADB 74LVC4245ADH TEMPERATURE RANGE -40 to +85 C PINS 24 24 24 DIR L H X An A=B inputs Z INPUT/OUTPUT
74LVC4245A
Bn inputs B=A Z
PACKAGE MATERIAL SO SSOP TSSOP plastic plastic plastic
CODE SOT137-1 SOT340-1 SOT355-1
DESCRIPTION DC supply voltage (5 V bus)
output enable input (active LOW) DC supply voltage (3 V bus)
1999 Jun 15
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
74LVC4245A
handbook, halfpage
VCCA 1 DIR 2 A0 3 A1 4 A2 5 A3 6
24 VCCB 23 VCCB 22 OE 21 B0 20 B1
4245
A4 7 A5 8 A6 9 A7 10 GND 11 GND 12
MNA451
19 B2 18 B3 17 B4 16 B5 15 B6 14 B7 13 GND 4 A1 B1 5 A2 B2 6 A3 B3 7 A4 B4 17 18 19 20 3 A0 B0 21
handbook, halfpage
2
DIR OE
22
Fig.1 Pin configuration.
handbook, halfpage
22 2
G3 3EN1 3EN2
8
A5 B5 16
9 1 3 4 5 6 7 8 9 10
MNA452
A6 B6 15
2
21 20 19 18 17 16 15 14
10
A7 B7 14
MNA453
Fig.3 IEC logic symbol.
Fig.2 Logic symbol.
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
RECOMMENDED OPERATING CONDITIONS
74LVC4245A
LIMITS SYMBOL VCCA VCCB VI VI/O PARAMETER DC supply voltage 5 V port (for maximum speed performance) DC supply voltage 3 V port (for low-voltage applications) DC input voltage range (control inputs) DC input voltage range; output 3-state DC output voltage range; output HIGH or LOW state Tamb tr,tf operating ambient temperature range input rise and fall times see DC and AC characteristics per device VCCB = 2.7 to 3.0 V VCCB = 3.0 to 3.6 V VCCA = 3.0 to 4.5 V VCCA = 4.5 to 5.5 V CONDITIONS MIN. VCCA VCCB (see Fig.5) VCCA VCCB (see Fig.5) 1.5 1.5 0 0 0 -40 0 0 0 0 MAX. 5.5 3.6 5.5 5.5 VCC +85 20 10 20 10 V V V V V C ns/V UNIT
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V). SYMBOL VCCA VCCB IIK VI IOK VI/O IO IGND, ICC Tstg Ptot PARAMETER DC supply voltage 5 V port DC supply voltage 3 V port DC input diode current DC input voltage DC output diode current DC input voltage; output 3-state DC output diode current DC VCC or GND current storage temperature power dissipation per package plastic mini-pack (SO) plastic shrink mini-pack (SSOP and TSSOP) Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. above 70 C derate linearly with 8 mW/K above 60 C derate linearly with 5.5 mW/K - - 500 500 mW mW VI < 0 note 1 VO > VCC or VO < 0 note 1 VO = 0 to VCC CONDITIONS MIN. -0.5 -0.5 - -0.5 - -0.5 -0.5 - - -65 MAX. +6.5 +4.6 -50 +6.5 50 VCC + 0.5 +6.5 50 100 +150 UNIT V V mA V mA V V mA mA C
DC output voltage; output HIGH or LOW note 1
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage (3 V port) 3 V port 5 V port 3 V port 5 V port VI = VIH or VIL; IO = -12 mA VI = VIH or VIL; IO = -100 A VI = VIH or VIL; IO = -24 mA HIGH-level output voltage (5 V port) VI = VIH or VIL; IO = -12 mA VI = VIH or VIL; IO = -100 A VI = VIH or VIL; IO = -24 mA VOL LOW-level output voltage (3 V port) VI = VIH or VIL; IO = 12 mA VI = VIH or VIL; IO = 100 A VI = VIH or VIL; IO = 24 mA LOW-level output voltage (5 V port) VI = VIH or VIL; IO = 12 mA VI = VIH or VIL; IO = 100 A VI = VIH or VIL; IO = 24 mA II IIHZ/IILZ input leakage current input current for common I/O pins (3 V port) input current for common I/O pins (5 V port) IOZ 3-state output OFF-state current (3 V port) 3-state output OFF-state current (5 V port) ICC quiescent supply current (3 V port) quiescent supply current (5 V port) ICC additional quiescent supply current per control pin (3 V port) additional quiescent supply current per control pin (5 V port) Notes 1. All typical values are at VCCA = 5.0 V, VCCB = 3.3 V and Tamb = 25 C. 2. Not for I/O pins. 1999 Jun 15 6 VI = 5.5 V or GND; note 2 VI = VCC or GND VI = VCC or GND VI = VIH or VIL; VO = VCC or GND VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0 VCCA/B (V)
74LVC4245A
Tamb (C) -40 to +85 MIN. TYP.(1) MAX. - - - - - - 0.8 0.8 - - - - - - 0.40 0.20 0.55 0.40 0.20 0.55 5 15 15 5 5 10 10 500 A A A A A A A A V V V V V V UNIT
2.7 to 3.6 2.0 4.5 to 5.5 2.0 2.7 to 3.6 - 4.5 to 5.5 - 2.7 3.0 3.0 4.5 4.5 4.5 2.7 3.0 3.0 4.5 4.5 4.5 3.6 3.6 5.5 3.6 5.5 3.6 5.5
VCC - 0.5 - VCC - 0.2 VCC VCC - 1.0 - VCC - 0.5 - VCC - 0.2 VCC VCC - 0.8 - - - - - - - - - - - - - - - - - - - - 0.1 0.1 0.1 0.1 0.1 0.1 0.1 5
2.7 to 3.6 -
VI = VCC - 2.1 V; IO = 0
4.5 to 5.5 -
5
500
A
Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns; CL = 50 pF; Tamb = -40 to 85 C. LIMITS SYMBOL PARAMETER WAVEFORMS VCCA = 5 V 0.5 V VCCB = 3.3 V 0.3 V MIN. tPHL/tPLH propagation delay An to Bn propagation delay Bn to An tPZH/tPZL 3-state output enable time OE to An 3-state output enable time OE to Bn tPHZ/tPLZ 3-state output disable time OE to An 3-state output disable time OE to Bn Notes 1. Typical values are measured at VCCA = 5.0 V and VCCB = 3.3 V and Tamb = 25 C. 2. Typical values are measured at VCCA = 5.0 V and Tamb = 25 C. AC WAVEFORMS see Figs 4 and 7 see Figs 4 and 7 see Figs 6 and 7 see Figs 6 and 7 see Figs 6 and 7 see Figs 6 and 7 1.5 1.5 1.5 1.5 1.5 1.5 TYP.(1) 4.0 4.0 6.2 5.0 5.3 5.8 MAX. 6.5 6.5 10 8.1 7.5 7.8
74LVC4245A
UNIT MAX. 7.0 7.0 11.0 8.7 8.0 8.5 ns ns ns ns ns ns
VCCB = 2.7 V MIN. TYP.(2) 1.5 1.5 1.5 1.5 1.5 1.5 4.5 4.5 7.0 5.7 5.7 6.2
handbook, halfpage V V handbook, halfpage VI
3.9 CCB (V) 3.6 3.3 3.0
MNA454
CCA VCCB
An, Bn INPUT GND tPHL VOH Bn, An OUTPUT VOL
VM
tPLH
2.7 2.4
VM
MNA366
2.1 1.8 1.5 1.2
VM = 1.5 V at 2.7 V VCCB 3.6 V; VM = 0.5VCCA at VCCA 4.5 V; VOL and VOH are typical output voltage drop that occur with the output load.
0.9 1.5 2.1 2.7 3.3 3.9 4.5 5.1 5.7 VCCA (V)
Full operation
Complies with TTL levels
Fig.4
The input (An, Bn) to output (Bn, An) propagation delays.
Fig.5 Supply operation area.
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
74LVC4245A
handbook, full pagewidth
VI OE INPUT GND tPLZ VCC OUTPUT LOW-to-OFF OFF-to-LOW VOL tPHZ VOH OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
MNA367
VM = 1.5 V at 2.7 V VCCB 3.6 V; VM = 0.5VCCA at VCCA 4.5 V; VX = VOL + 0.3 V at VCCB 3.6 V; VX = VOL + 0.1 (VCCA - VOL) at VCCA 4.5 V
VY = VOH - 0.3 V at VCCB 3.6 V; VY = VOH - 0.1 (VOH - GND) at VCCA 4.5 V; VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 The 3-state enable and disable times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO RL 500
2 x VCC open GND
MNA368
VCC for A and B port <2.7 V for B port 2.7 to 3.6 V for A port 4.5 to 5.5 V VCC
VI
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND
2.7 V 3.0 V
Definitions for test circuit: RL = Load resistor; see chapter "AC characteristics". CL = Load capacitance including jig and probe capacitance (see chapter "AC characteristics"). RT = Termination resistance should be equal to the output impedance Z0 of the pulse generator.
Fig.7 Load circuitry for switching times.
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
PACKAGE OUTLINES SO24: plastic small outline package; 24 leads; body width 7.5 mm
74LVC4245A
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Jun 15
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
74LVC4245A
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1999 Jun 15
10
Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
74LVC4245A
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153AD EIAJ EUROPEAN PROJECTION ISSUE DATE 93-06-16 95-02-04 A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8o 0o
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
74LVC4245A
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Jun 15
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable
74LVC4245A
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Jun 15
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Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
NOTES
74LVC4245A
1999 Jun 15
14
Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
NOTES
74LVC4245A
1999 Jun 15
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 66
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/03/pp16
Date of release: 1999 Jun 15
Document order number:
9397 750 06037

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